AI Semiconductor Cooling
Connecting bubble dynamics and surface structure to cooling limits.
Two-phase immersion cooling removes chip heat through boiling in a dielectric fluid. We study how surface structure and orientation affect bubble dynamics and critical heat flux (CHF).
From test facilities to bubbles and surfaces

Measuring boiling performance under changing heat loads

Observing the heated surface and bubbles

Relating surface structure to boiling behaviour

Comparing pore structure and surface wettability

High-speed imaging of growth and departure

Evaluating heat flux against wall superheat
How It Works
Fluid Submersion
Servers submerged in dielectric fluid
Two-Phase Boiling
Fluid boils, absorbing massive heat via latent heat
Condense & Recirculate
Vapor condenses, natural circulation loop
Research activities
- Inha University · 2025
EV Battery Immersion Cooling via Boiling
We study boiling in dielectric fluids for battery cooling. Tests evaluate heat removal and temperature uniformity.
- 3 related papers
Metal Foam-Enhanced Boiling Heat Transfer
We compare boiling across copper foam pore sizes, thicknesses, and orientations. Tests evaluate heat transfer coefficients and critical heat flux.
- 1 related paper
CHF Dependence on Surface Orientation
We examine how surface orientation and bubble dynamics affect critical heat flux on silicon and silicon dioxide.
- KR 10-2855737
Gas-Liquid Flow Path Separation Patent
The patented design separates gas and liquid flow paths. It aims to reduce bubble interference during battery immersion cooling.









